IJSER Home >> Journal >> IJSER
International Journal of Scientific and Engineering Research
ISSN Online 2229-5518
ISSN Print: 2229-5518 11    
Website: http://www.ijser.org
scirp IJSER >> Volume 2, Issue 11, November 2011
3-D Camera SoPC Design Architecture
Full Text(PDF, 3000)  PP.  
Prof. Shashank Pujari
DSP, FPGA, SoPC, Camera, Embedded
It is often seen that the available knowledge base within an organisation influences the selection of the design platform. The two major contenders for signal processing hardware platforms are DSP processor and FPGA. DSP processor offers high compute intensive complete embedded product where as FPGA offers high flexibility to a System on Programmable Chip (SoPC) designer for proof of concept at formative stage of the system design leading to manufacturable prototype at a later stage before the final ASIC implementation. The constraint aware design brings forth many challenges in terms of cost, size, memory, performance and time to market. The paper highlights the design cycle of finding the right platform after weighing the pros and cons of the design constraints and the design space exploration by way of a project based case study of a 3-D camera controller SoPC design on FPGA.
[1] Tobias Möller, Holger Kraft, Jochen Frey,Martin Al-brecht, Robert Lange, Robust 3D Measurement with PMD Sensors, PMDTechnologie, Germany

[2] T. Ringbeck, T. M¨oller, and B. Hagebeuker, Multidi-mensional measurement by using 3-D PMD sensors, PMDTechnologies, Germany

[3] Stefan Vacek, Thomas Schamm, Joachim Schr¨oder, R¨udiger Dillmann, Collision Avoidance For Cognitive Au-tomobiles Using A 3d Pmd Camera, Institute of Computer Science and Engineering, University Karlsruhe (TH), Ger-many

[4] PMD 19k sensor datasheet, www.pmdtec.com;

[5] Xilinx FPGA and CPLD, www.xilinx.com;

[6] BlackFin DSP processor, www.analog.com;

[7] Xilinx Synthesis Tool ISE 7.2, www.xilinx.com;

Untitled Page