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International Journal of Scientific and Engineering Research
ISSN Online 2229-5518
ISSN Print: 2229-5518 5    
Website: http://www.ijser.org
scirp IJSER >> Volume 2, Issue 5, May 2011 Edition
Effect of Temperature on Deformation Characteristics of Gold Ball Bond in Au-Al Thermosonic Wire Bonding
Full Text(PDF, 3000)  PP.  
Gurbinder Singh, Othman Mamat
Gold ball bond, Intermetallic phase , Shear strength, Thermosonic wire bonding
Wire bonding is a process that is used to form solid-state bonds to interconnect metals such as gold wires to metalized pads deposited on silicon integrated circuits. Typically, there are 3 main wire bonding techniques; Thermo-compression, Ultrasonic and Thermosonic. This experiment utilizes thermosonic bonding which applies heat, ultrasonic energy and force on an Au-Al system. Sixteen groups of bonding conditions at various temperature settings were compared to establish the relationship between ball deformation and temperature. The results of this study will clearly indicate the effects of applied bonding temperature towards bond strength and deformation characteristics of gold ball bonding.
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