Effect of Temperature on Deformation Characteristics of Gold Ball Bond in Au-Al Thermosonic Wire Bonding
|
Full Text(PDF, 3000) PP.
|
|
Author(s) |
Gurbinder Singh, Othman Mamat |
|
KEYWORDS |
Gold ball bond, Intermetallic phase , Shear strength, Thermosonic wire bonding
|
|
ABSTRACT |
Wire bonding is a process that is used to form solid-state bonds to interconnect metals such as gold wires to metalized pads deposited on silicon integrated circuits. Typically, there are 3 main wire bonding techniques; Thermo-compression, Ultrasonic and Thermosonic. This experiment utilizes thermosonic bonding which applies heat, ultrasonic energy and force on an Au-Al system. Sixteen groups of bonding conditions at various temperature settings were compared to establish the relationship between ball deformation and temperature. The results of this study will clearly indicate the effects of applied bonding temperature towards bond strength and deformation characteristics of gold ball bonding.
|
|
References |
|
[1] Antony, J., “Improving the wire bonding process
quality using statistically designed experiments”, J.
Microelectronics. 30, 161-168, 1999.
[2] Liang, Z.N., Kuper, F.G., “A concept to relate wire
bonding parameters to bondability and ball bond
reliability.” J. Microelectronics. 38, 1278-1291, 1998.
[3] Hu, S.J., Lim,G.E., Lim,T.L., “Study of temperature
parameter on the thermosonic gold wire bonding of
high-speed CMOS.” IEEE. J. Transactions on
components, hybrids and manufacturing.4, 855-858,
1991.
[4] Wu,Y.X., Long, Z.L., Han Lei., Zhong Jue.,
“Temperature effect in thermosonic wire
bonding.” J. Transactions on non-ferrous materials
society, 618-622, 2006.
[5] Long, Z.L., Lei Han, Wu, Y.X., Jue Zhong., “Study of
Temperature Parameter in Au-Ag wire Bonding.“
IEEE. J. Transactions on Electronics Packaging
Manufacturing. 3, 31, 2008.
[6] Lei Han, Wang, F.L., Xu, W.H., “Bondability window
and power input for wire bonding.”J. Microelectronics
Reliability. 46, 610-615., 2006.
[7] Srikanth, N., Murali, S., Wong, Y.M., “Critical study of
thermosonic copper ball bonding.” J. Thin Solid Flims.
462, 339-345, 2004.
[8] Li, M.Y., Ji, H.J., Wang, C., “Interdiffusion of Al-Ni
system enhance by ultrasonic vibration at ambient
temperature.” J. Ultrasonics. 45, 61-65, 2006.
[9] Liu, D.S.,Ni, C.Y., “A thermo mechanical study on the
electrical resistance of aluminum wire conductors. “
J. Microelectron.Rel. 42, 367-374, 2002.
[10] Murali, S., “Formation and growth of intermetallics
in thermosonic wire bonds: Significance of vacancysolute
binding energy.” J. Alloys compounds.
426, 200-207, 2006.
[11] Cohen, L., “Time-Frequency Analysis. “ Prentice-
Hall, Eaglewood Cliffs, NJ, 1995.
[12] Zhang, D., Ling, S., “Monitoring Wire Bonding via
Time-frequency Analysis of horn vibration.” IEEE.J.
Trans.electron.Packag.Manuf. 26, 216-220, 2006.
|
|
|