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International Journal of Scientific and Engineering Research
ISSN Online 2229-5518
ISSN Print: 2229-5518 5    
Website: http://www.ijser.org
scirp IJSER >> Volume 2, Issue 5, May 2011 Edition
Effect of Temperature on Deformation Characteristics of Gold Ball Bond in Au-Al Thermosonic Wire Bonding
Full Text(PDF, 3000)  PP.  
Author(s)
Gurbinder Singh, Othman Mamat
KEYWORDS
Gold ball bond, Intermetallic phase , Shear strength, Thermosonic wire bonding
ABSTRACT
Wire bonding is a process that is used to form solid-state bonds to interconnect metals such as gold wires to metalized pads deposited on silicon integrated circuits. Typically, there are 3 main wire bonding techniques; Thermo-compression, Ultrasonic and Thermosonic. This experiment utilizes thermosonic bonding which applies heat, ultrasonic energy and force on an Au-Al system. Sixteen groups of bonding conditions at various temperature settings were compared to establish the relationship between ball deformation and temperature. The results of this study will clearly indicate the effects of applied bonding temperature towards bond strength and deformation characteristics of gold ball bonding.
References
[1] Antony, J., “Improving the wire bonding process quality using statistically designed experiments”, J. Microelectronics. 30, 161-168, 1999.

[2] Liang, Z.N., Kuper, F.G., “A concept to relate wire bonding parameters to bondability and ball bond reliability.” J. Microelectronics. 38, 1278-1291, 1998.

[3] Hu, S.J., Lim,G.E., Lim,T.L., “Study of temperature parameter on the thermosonic gold wire bonding of high-speed CMOS.” IEEE. J. Transactions on components, hybrids and manufacturing.4, 855-858, 1991.

[4] Wu,Y.X., Long, Z.L., Han Lei., Zhong Jue., “Temperature effect in thermosonic wire bonding.” J. Transactions on non-ferrous materials society, 618-622, 2006.

[5] Long, Z.L., Lei Han, Wu, Y.X., Jue Zhong., “Study of Temperature Parameter in Au-Ag wire Bonding.“ IEEE. J. Transactions on Electronics Packaging Manufacturing. 3, 31, 2008.

[6] Lei Han, Wang, F.L., Xu, W.H., “Bondability window and power input for wire bonding.”J. Microelectronics Reliability. 46, 610-615., 2006.

[7] Srikanth, N., Murali, S., Wong, Y.M., “Critical study of thermosonic copper ball bonding.” J. Thin Solid Flims. 462, 339-345, 2004.

[8] Li, M.Y., Ji, H.J., Wang, C., “Interdiffusion of Al-Ni system enhance by ultrasonic vibration at ambient temperature.” J. Ultrasonics. 45, 61-65, 2006.

[9] Liu, D.S.,Ni, C.Y., “A thermo mechanical study on the electrical resistance of aluminum wire conductors. “ J. Microelectron.Rel. 42, 367-374, 2002.

[10] Murali, S., “Formation and growth of intermetallics in thermosonic wire bonds: Significance of vacancysolute binding energy.” J. Alloys compounds. 426, 200-207, 2006.

[11] Cohen, L., “Time-Frequency Analysis. “ Prentice- Hall, Eaglewood Cliffs, NJ, 1995.

[12] Zhang, D., Ling, S., “Monitoring Wire Bonding via Time-frequency Analysis of horn vibration.” IEEE.J. Trans.electron.Packag.Manuf. 26, 216-220, 2006.

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