IJSER Home >> Journal >> IJSER
International Journal of Scientific and Engineering Research
ISSN Online 2229-5518
ISSN Print: 2229-5518 4    
Website: http://www.ijser.org
scirp IJSER >> Volume 2, Issue 4, April 2011 Edition
Effect of Nanofluid Concentration on the Performance of Circular Heat Pipe
Full Text(PDF, 3000)  PP.  
Author(s)
M. G. Mousa
KEYWORDS
Heat Pipe, Thermal Performance, Nanofluids
ABSTRACT
The goal of this paper is to experimentally study the behavior of nanofluid to improve the performance of a circular heat pipe. Pure water and Al2O3-water based nanofluid are used as working fluids. An experimental setup is designed and constructed to study the heat pipe performance under different operating conditions. The effect of filling ratio, volume fraction of nano-particle in the base fluid, and heat input rate on the thermal resistance is investigated. Total thermal resistance of the heat pipe for pure water and Al2O3-water based nanofluid is also predicted. An experimental correlation is obtained to predict the influence of Prandtl number and dimensionless heat transfer rate, Kq on thermal resistance. Thermal resistance decreases with increasing Al2O3-water based nanofluid compared to that of pure water. The experimental data is compared to the available data from previous work. The agreement is found to be fairly good.
References
[1] T. Kaya, R. Pe´rez, C. Gregori and A.Torres, ""Numerical simulation of transient operation of loop heat pipes"", Applied Thermal Engineering, vol.28, 2008, pp.967-974.

[2] S. W. Kang, W. C. Wei, S. H. Tsai, and S. Y. Yang, ""Experimental investigation of silver nanofluid on heat pipe thermal performance"", Applied Thermal Engineering, vol.26, 2006, pp.2377–2382.

[3] V.G. Pastukhov, Y. F. Maidanik, C.V. Vershinin, and M.A. Korukov, ""Miniature loop heat pipes for electronics cooling"", Applied Thermal Engineering, vol.23, 2000, pp.1125-1135.

[4] Y. W. Chang, C. H. Cheng, J. C. Wang, and S. L. Chen,"" Heat pipe for cooling of electronic equipment"" Energy Conversion and Management, 2008.

[5] H. Jouhara1, O. Martinet, and A.J. Robinson, “Experimental Study of Small Diameter Thermosyphons Charged with Water"", FC-84, FC-77 & FC- 3283- 5th European Thermal-Sciences Conference, The Netherlands, 2008.

[6] S. Lips, F. Lefèvre, and J. Bonjou, ""Combined effects of the filling ratio and the vapour space thickness on the performance of a flat plate heat pipe"", International Journal of Heat and Mass Transfer vol. 53, 2010, pp. 694–702.

[7] S. K. Das, U.S. Choi, W. Yu, and T. Pradeep, ""Nanofluid Science and Technology"", Wily-Interscience, 2007.

[8] Das, S. K., Putra, N., Thiesen, P., and Roetzel, W., ""Temperature dependence of thermal conductivity enhancement for nanofluids"", J. Heat Transfer vol.125, 2003, pp. 567-574.

[9] R.B. Mansour, N. Galanis, and C.T. Nguyen, "" Effect of uncertainties in physical properties on forced convection heat transfer with nanofluids,"" Applied Thermal Engineering Vol. 27, 2007, pp. 240–249.

[10] S. Lee, S.U.S Choi, S. Li., and J.A. Eastman, ""Measuring thermal conductivity of fluids containing oxide nanoparticles,"" J. Heat Transfer vol. 121, 1999, pp. 280-289.

Untitled Page